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Analytical and mechanical methods for material property investigations of SnAgCu-solder

: Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.1 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0533-X
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Conference Paper
Fraunhofer IWM ()
lead-free solder material; mechanical property; indentation testing; microstructure analysis; nanoparticle; TEM; dislocation

The development of lead-free solder materials with improved reliability properties requires a detailed understanding of the relationship between mechanical properties and microstructure. The paper presents methods that can be applied to characterize creep and plastic deformation behaviour and shows how currently available analytical methods for microstructure investigations can be used to track the physical origin of the observed mechanical behaviour. The paper will specifically describe advantages and use of mechanical and analytical tools, like nanoindentation, FIB, SEM, TEM and EDX in the field of solders for interconnects in electronic packaging.