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Reliable matching of 300 mm defect inspection tools @ sub 60 nm defect size

 
: Nutsch, A.; Supplieth, F.; Pfitzner, L.; Ryssel, H.

:

IEEE Electron Devices Society; IEEE Components, Packaging, and Manufacturing Technology Society; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.; Japan Society of Applied Physics -JSAP-:
ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing. Conference proceedings : September 13 - September 15, 2005, San Jose, California
Piscataway, NY: IEEE, 2005
ISBN: 0-7803-9143-8
pp.245-248
International Symposium on Semiconductor Manufacturing (ISSM) <2005, San Jose/Calif.>
English
Conference Paper
Fraunhofer IISB ()

: http://publica.fraunhofer.de/documents/N-49261.html