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Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs

 
: Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.

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Rhoades, R. ; Electrochemical Society -ECS-; Electrochemical Society -ECS-, Dielectric Science and Technology Division:
Chemical Mechanical Polishing 14 : 229th ECS Meeting, May 29, 2016 - June 2, 2016, San Diego, California
Pennington, NJ: ECS, 2016 (ECS transactions 72. 2016, Nr.18)
ISBN: 978-1-62332-387-5
ISBN: 978-1-60768-745-0
pp.17-24
Symposium Chemical Mechanical Polishing <2016, San Diego/Calif.>
Electrochemical Society (ECS Meeting) <229, 2016, San Diego/Calif.>
English
Conference Paper
Fraunhofer ENAS ()
Fraunhofer IZM ()

Abstract
This paper describes the potential of a membrane carrier upgrade for legacy CMP tools, such as an IPEC 472. Seventeen different polish parameter settings were applied for both, 150 mm and 200 mm wafers in order to cover a wide range of applications. Resulting from these experiments, a significant performance gain in comparison to stiff carriers becomes evident.

: http://publica.fraunhofer.de/documents/N-491420.html