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Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding

 
: Eichler, M.; Michel, B.; Thomas, M.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.; Klages, C.-P.

Saga University:
HAKONE X, 10th International Symposium on High Pressure Low Temperature Plasma Chemistry 2006 : Contributed papers; Saga University, Saga, Japan, September 4th - 8th, 2006
Saga, 2006
pp.322-325
International Symposium on High Pressure Low Temperature Plasma Chemistry <10, 2006, Saga>
English
Conference Paper
Fraunhofer IST ()

Abstract
Two new atmospheric-pressure plasma processes, Local Plasma Treatment (LPT) and Plasma Printing (PP), are described, which allow a localized dielectric barrier discharge (DBD) treatment at predefined areas of a semiconductor wafer. At LPT method an etched structure on the surface of the wafer defines the pattern for plasma activation, whereas the principle of PP is vice versa: the flat surface of a silicon wafer is locally treated with DBDs which are defined by a structured electrode.

: http://publica.fraunhofer.de/documents/N-49137.html