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2018
Conference Paper
Titel
Automated, modular hybrid AM machine for 3D printed electrical microsystems
Abstract
Nowadays one of the main requirements and therefore technology drivers in the field of microelectronic and -mechatronic systems are application based individualization, miniaturization as well as a high functional density. Market available manufacturing methods are restricted due to e.g. geometric limitations and flexibility. A hybrid process chain based on a multi-material additive process in combination with other manufacturing processes could overcome these restrictions and would be an enabler for the economic production of individualized microsystems in small lot sizes. This paper presents the realization and potential applications of a fully automated and modular hybrid machine, developed in the EU Project NextFactory. The machine combines additive and further manufacturing methods clustered into four modules enabling the production of a multitude of microsystems: Module I) 3D inkjet printing and functional material deposition; Module II) Dispensing and micro assembly; Module III) UV curing and IR, NIR sintering; Module IV) Quality and inspection. Concepts for economic scaling and acceleration of the manufacturing process are shown in the outlook.
Author(s)