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Real time solid waste monitoring using cloud and sensors technologies

 
: Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.

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Fulltext (PDF; )

Isman, A.:
International Science and Technology Conference, ISTEC 2017 America. Proceedings Book. Online resource : August 16-18, 2017, Cambridge, MA, USA; ISTEC Europe, International Science and Technology Conference, July 17-19, 2017, Berlin, Germany
Online im WWW, 2017
http://www.iste-c.net/publication_folder/istec/istec2017.pdf
pp.441-450
International Science and Technology Conference (ISTEC America) <2017, Cambridge/Mass.>
International Science and Technology Conference (ISTEC Europe) <2017, Berlin>
English
Conference Paper, Electronic Publication
Fraunhofer ENAS ()

Abstract
The rise of urbanization and increase of human population correspond to the amount of solid waste produced. Inappropriate solid waste management poses risk to the environment as well as to the healthy living of people. Outmoded way of solid waste management is a cumbersome and complex process, which utilizes more valued human effort, time and cost and is not well matched with advancement in technologies. In this work, a smart bin solution is shown with a three-layered architecture for IoT real time solid waste monitoring. The lower layer is installed with sensors for measuring waste levels in smart bins; the middle layer is comprised with both Wi-Fi and GSM technologies for data transmission to a central system. A cloud service for receiving and storing data from the sensors is on the upper layer. In order to collect waste, the corresponding cleaning service is notified whenever a smart bin level threshold is reached. Ultrasonic ranger sensor and laser distance sensors were implemented and tested. A web based system to store user’s information necessary for monitoring was also developed. The technologies used in the proposed system can solve the problem associated with solid waste monitoring and management and thus provides green environment.

: http://publica.fraunhofer.de/documents/N-481574.html