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Hybrid photonic integration on a polymer platform

: Zhang, Z.; Felipe, D.; Katopodis, V.; Groumas, P.; Kouloumentas, C.; Avramopoulos, H.; Dupuy, J.-Y.; Konczykowska, A.; Dede, A.; Beretta, A.; Vannucci, A.; Cangini, G.; Dinu, R.; Schmidt, D.; Moehrle, M.; Runge, P.; Choi, J.-H.; Bach, H.-G.; Grote, N.; Keil, N.; Schell, M.

Fulltext ()

Photonics 2 (2015), No.3, pp.1005-1026
ISSN: 2304-6732
Journal Article, Electronic Publication
Fraunhofer HHI ()

To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, passive insertion of thin-film-based optical elements, and on-chip attachment of optical fibers. This work reviews the recent progress of our polyboard platform. On the fundamental level, multi-core waveguides and polymer/silicon nitride heterogeneous waveguides have been fabricated, broadening device design possibilities and enabling 3D photonic integration. Furthermore, 40-channel optical line terminals and compact, bi-directional optical network units have been developed as highly functional, low-cost devices for the wavelength division multiplexed passive optical network. On a l arger scale, thermo-optic elements, thin-film elements and an InP gain chip have been integrated on the polyboard to realize a colorless, dual-polarization optical 90° hybrid as the frontend of a coherent receiver. For high-end applications, a wavelength tunable 100Gbaud transmitter module has been demonstrated, manifesting the joint contribution from the polyboard technology, high speed polymer electro-optic modulator, InP driver electronics and ceramic electronic interconnects.