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Germanium "hexa" detector. Production and testing

 
: Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.

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Journal of Instrumentation 12 (2017), Art. C01068, 11 pp.
ISSN: 1748-0221
International Workshop on Radiation Imaging Detectors (IWORID) <18, 2016, Barcelona>
English
Journal Article, Conference Paper
Fraunhofer IZM ()

Abstract
Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called "hexa". Its dimensions are 45 × 30 mm2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to −126°C and noise levels together with flat field response are measured. For −200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm2). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.

: http://publica.fraunhofer.de/documents/N-481040.html