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Tackling low temperature bonding in fine pitch applications

 
: Oppermann, H.; Lang, K.-D.

:

Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-, Japan Chapter:
5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings : May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-1598-0
ISBN: 978-4-904743-03-4
ISBN: 978-4-904743-05-8
pp.41
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Fine pitch flip chip applications and small sealing ring structures are demanding for metal interconnects. Thermocompression bonding requires higher temperature. Examples are shown how to reduce bonding temperatures in different applications.

: http://publica.fraunhofer.de/documents/N-480962.html