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High-radiance LDP source for mask inspection and beam line applications (Conference Presentation)

: Teramoto, Y.; Santos, B.; Mertens, G.; Kops, R.; Kops, M.; Wezyk, A. von; Bergmann, K.; Yabuta, H.; Nagano, A.; Ashizawa, N.; Taniguchi, Y.; Yamatani, D.; Shirai, T.; Kasama, K.


Panning, E.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Extreme Ultraviolet (EUV) Lithography VIII : 27 February - 2 March 2017, San Jose, California, United States
Bellingham, WA: SPIE, 2017 (Proceedings of SPIE 10143)
ISBN: 978-1-5106-0737-8
ISBN: 978-1-5106-0738-5
Paper 101431L
Conference "Extreme Ultraviolet (EUV) Lithography" <8, 2017, San Jose/Calif.>
Conference Paper
Fraunhofer ILT ()

High-throughput actinic mask inspection tools are needed as EUVL begins to enter into volume production phase. One of the key technologies to realize such inspection tools is a high-radiance EUV source of which radiance is supposed to be as high as 100 W/mm2/sr. Ushio is developing laser-assisted discharge-produced plasma (LDP) sources. Ushio's LDP source is able to provide sufficient radiance as well as cleanliness, stability and reliability. Radiance behind the debris mitigation system was confirmed to be 120 W/mm2/sr at 9 kHz and peak radiance at the plasma was increased to over 200 W/mm2/sr in the recent development which supports high-throughput, high-precision mask inspection in the current and future technology nodes. One of the unique features of Ushio's LDP source is cleanliness. Cleanliness evaluation using both grazing-incidence Ru mirrors and normal-incidence Mo/Si mirrors showed no considerable damage to the mirrors other than smooth sputtering of the surface at the pace of a few nm per Gpulse. In order to prove the system reliability, several long-term tests were performed. Data recorded during the tests was analyzed to assess two-dimensional radiance stability. In addition, several operating parameters were monitored to figure out which contributes to the radiance stability. The latest model that features a large opening angle was recently developed so that the tool can utilize a large number of debris-free photons behind the debris shield. The model was designed both for beam line application and high-throughput mask inspection application. At the time of publication, the first product is supposed to be in use at the customer site.