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Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry

Presentation held at 36th International Conference on Thermoelectrics, ICT 2017, 31st July - 3rd August 2017, Pasadena, California, USA
 
: Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.

2017, 24 Folien
International Conference on Thermoelectrics (ICT) <36, 2017, Pasadena/Calif.>
English
Presentation
Fraunhofer IPMS ()
Fraunhofer ENAS ()
Anfrage beim Institut / Available on request from the institute bibliothek@ipms.fraunhofer.de

: http://publica.fraunhofer.de/documents/N-480007.html