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Customized BSOI wafers integration of additional interconnects into the handle wafer

Presentation held at Waferbond 2017, the International Conference on Wafer Bonding, 27 - 29 November 2017, Leuven, Belgium
 
: Kaden, Christiane; Langa, Sergiu

2017, 10 Folien
International Conference on Wafer Bonding (Waferbond) <2017, Leuven>
English
Presentation
Fraunhofer IPMS ()
Anfrage beim Institut / Available on request from the institute bibliothek@ipms.fraunhofer.de

: http://publica.fraunhofer.de/documents/N-480005.html