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A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
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2017
Conference Paper
Titel
A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Author(s)
Hu, X.
Bäuscher, M.
Mukhopadhyay, B.
Mackowiak, P.
Ehrmann, O.
Lang, K.-D.
Fritz, M.
Hansen, U.
Maus, S.
Gyenge, O.
Ngo, H.-D.
Hauptwerk
Smart Systems Integration 2017
Konferenz
International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM