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A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer

 
: Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.

Otto, T. ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, 8 - 9 March 2017, Cork, Ireland
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2017
ISBN: 978-3-95735-057-2
ISBN: 3-95735-057-3
pp.98-105
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2017, Cork>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-473827.html