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Integration of self-healing agent into MEMS bonding frames

 
: Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.

Otto, T. ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, 8 - 9 March 2017, Cork, Ireland
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2017
ISBN: 978-3-95735-057-2
ISBN: 3-95735-057-3
pp.395-398
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2017, Cork>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper presents a novel approach of an autonomous self healing mechanism integrated into MEMS devices with the aim to achieve a higher reliability of MEMS with respect to the hermetic encapsulation.

: http://publica.fraunhofer.de/documents/N-473803.html