Abstract
In this paper, the suitability of two types of die attach (DA) material within an isolating system is compared: non-conductive and antistatic epoxy adhesives, respectively. The electrical conductivity of second material has been adjusted by density, size, and shape of carbon filler particles incorporated into the resin matrix. The study shows that micro-voids inside die attach layers of a semiconductor package can lead to partial discharges (PD). Such discharges are reduced by a design-in of carbon filled glues into the device. The experimental verification of the simulation shows increased partial discharge immunity, improved by conductivity tuning of the adhesive materials.