• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Characterization of partial discharge performance of die attach adhesives
 
  • Details
  • Full
Options
2017
Journal Article
Title

Characterization of partial discharge performance of die attach adhesives

Abstract
In this paper, the suitability of two types of die attach (DA) material within an isolating system is compared: non-conductive and antistatic epoxy adhesives, respectively. The electrical conductivity of second material has been adjusted by density, size, and shape of carbon filler particles incorporated into the resin matrix. The study shows that micro-voids inside die attach layers of a semiconductor package can lead to partial discharges (PD). Such discharges are reduced by a design-in of carbon filled glues into the device. The experimental verification of the simulation shows increased partial discharge immunity, improved by conductivity tuning of the adhesive materials.
Author(s)
Schaller, R.
Strutz, V.
Theuss, H.
Dudek, Rainer  
Rzepka, Sven  
Journal
Materials today. Proceedings  
Conference
International Conference on Integrated Functional nano Systems (nanoFIS) 2016  
DOI
10.1016/j.matpr.2017.08.009
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024