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A novel technology for MEMS based on the agglomeration of powder by atomic layer deposition

: Lisec, T.; Chemnitz, S.; Lofink, F.; Reimer, T.; Kulkarni, A.; Piechotta, G.; Wagner, B.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 : 18-22 June 2017, Kaohsiung, Taiwan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-2732-7
ISBN: 978-1-5386-2733-4
ISBN: 978-1-5386-2731-0
International Conference on Solid-State Sensors, Actuators, and Microsystems (TRANSDUCERS) <19, 2017, Kaohsiung/Taiwan>
Conference Paper
Fraunhofer ISIT ()

A novel disruptive fabrication technique for MEMS is presented, based on the agglomeration of powders into three-dimensional porous structures by atomic layer deposition (ALD). Since ALD is performed at low temperatures, such structures can be created from a broad variety of materials on top or embedded within a substrate. The porous structures are thermally and mechanically robust enough to allow further processing of such substrates in a common back-end-of-line (BEOL) environment. The new technique extends the variety of functional materials for MEMS. Moreover, 3D microstructures with certain porosity and a large inner surface with tailored properties can be fabricated in a simple manner. That opens up unique prospects for future MEMS.