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Integrative Development of MID

 
: Jürgenhake, C.; Schierbaum, T.; Fischer, C.; Dumitrescu, R.

Three-dimensional molded interconnect devices (3D-MID) : Materials, manufacturing, assembly, and applications for injection molded circuit carriers
München: Hanser, 2014
ISBN: 1-56990-552-5 (electronic)
ISBN: 978-1-56990-552-4 (electronic)
ISBN: 1-56990-551-7 (print)
ISBN: 978-1-56990-551-7 (print)
pp.217-273
English
Book Article
Fraunhofer IPT ()

: http://publica.fraunhofer.de/documents/N-470082.html