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Micro-optics soldering on multifunctional system platforms

: Beckert, E.; Banse, H.; Eberhardt, R.; Tünnermann, A.


Thienpont, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Europe, Cardiff:
Micro-optics, VCSELs, and photonic interconnects II: fabrication, packaging, and integration : 3 - 5 April 2006, Strasbourg, France
Bellingham, Wash.: SPIE, 2006 (SPIE Proceedings Series 6185)
ISBN: 0-8194-6241-1
Paper 618509
Photonics Europe Symposium <2006, Strasbourg>
Conference Paper
Fraunhofer IOF ()
ceramic platform; optoelectronics; soldering; system integration

Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding for optoelectronical systems is introduced. Using a solder alloy that can be processed fluxless (e.g. 80Au20Sn) more functionality than pure position securing, for instance electrical connections and heat sinks for laseroptics, can be incorporated into the joint. Along with smart system platforms, made from ceramics and composites, providing the right interfaces for such functional joints a dense integration of optical and heat generating electrooptical components becomes possible.