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Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

 
: Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny

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Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-, Japan Chapter:
5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings : May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-1598-0
ISBN: 978-4-904743-03-4
ISBN: 978-4-904743-05-8
pp.13
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Summary form only given. This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.

: http://publica.fraunhofer.de/documents/N-467696.html