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Accelerated SLID bonding for fine-pitch interconnects with porous microstructure

: Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.


IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2017, the 67th Electronic Components and Technology Conference : 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-6315-4 (online)
ISBN: 978-1-5090-6316-1 (print)
ISBN: 978-1-5090-4332-3 (USB)
Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>
Conference Paper
Fraunhofer IZM ()

Solid-liquid interdiffusion (SLID) inter connects based on Cu and Sn-solder are excellent candidates for stacking of Si chips in 3D integration. If the high-temperature stable intermetallic compound (IMC) Cu3Sn is desired, the manufacturing of the interconnect can be very time consuming(long annealing time for growth of Cu3Sn). In this paper wepropose a method for the accelerated formation of Cu-Cu3Sn-Cu interconnects by selective dissolution of Sn from Cu6Sn5. This leads to a porous network of Cu3Sn. The influence of temperature, flux and atmosphere onto the pore formation will be addressed in detail.