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Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines

: Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.


IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2017, the 67th Electronic Components and Technology Conference : 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-6315-4 (online)
ISBN: 978-1-5090-6316-1 (print)
ISBN: 978-1-5090-4332-3 (USB)
Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>
Conference Paper
Fraunhofer IZM ()

The paper shows the design and first experimental results of a hybrid integrated glass-silicon based interposer for data communication at a wavelength of 850 nm. All processes are carried out on wafer level followed by component assembly steps. This paper describes process development for HF lines, Through-Glass-Via metallization and optical interconnection necessary to create a glass-based interposer for mid-board-optics. The assembled interposer is measured for data rates up to 25 Gb/s and shows high tolerances for optical coupling.