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A new method for prediction of corrosion processes in metallization systems for substrates and electrical contacts

: Klengel, S.; Stpehan, T.; Spohn, U.


IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2017, the 67th Electronic Components and Technology Conference : 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-6315-4 (online)
ISBN: 978-1-5090-6316-1 (print)
ISBN: 978-1-5090-4332-3 (USB)
Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>
Conference Paper
Fraunhofer IMWS ()

We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes. Additionally the method allows quantitative results for the specimen tested. In this paper we will present and discuss the new method for corrosion testing in correlation to standard reliability tests, like mixed flow gas testing (MFG). Furthermore high resolution microstructural analyzes after standard reliability testing as well as after cyclic voltammetrically investigation are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyzes (EDS) for samples after standard testing and after applying the new test method. Finally the corrosion processes induced by the different tests will be compared and discussed.