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Höchstpräzisions-Greifmodul mit integrierter Winkellagekorrektur

: Schulz, B.

VDI/VDE Innovation+Technik, Berlin:
Clustermeeting Mess- und Prüftechnik für den Test von Mikrosystemen 2006. Tagungsband : 31.05.06-01.06.2006
Berlin: VDI/VDE, 2006
ISBN: 3-89750-144-9
Clustermeeting "Mess- und Prüftechnik für den Test von Mikrosystemen" <2006, Nürnberg>
Conference Paper
Fraunhofer IWU ()
MIMS; Montageintegrierte Multisensor 3D-Messtechnik; Mikromontage; Winkellagekorrektur; Präzisionsgreifer; Tiltfunktion; Biegegelenkanordnung; assembly integrated multi-sensor 3D-measurement; micro assembly; angle correction; angle adjustment; precision gripper; tilt function; solid state hinge

An essential aim of the German joint research project MIMS is the integration of three-dimensional measurement in a highest-precision system for micro-assembly.
One important step in the sub-project of Fraunhofer IWU is the investigation of useable micro-actuator principles for gripper integrated position correction, to realize a high-precise component alignment directly in the working space of a micro-assembly system in addition to the 3D-measuring. The solution concept bases on the development of a novel gripping module, that joins the functions of a precision gripper and a measuring head. The first developed prototype enables the safe handling of sensible electric-optical devices with pairwise arranged micro-finger grippers and allows the adjusting and holding of minimum angle positions (down to 0.004°) for high-precise alignment with the help of a new developed solid state hinges structure. The paper presents first testing results and shows the specified MIMS-concept to integrate the gripping unit in a high-precision 5axis-positioning system by LPKF.