Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
| Tanner, D.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24 - 25 January 2005, San Jose, California, USA
Bellingham/Wash.: SPIE, 2005 (SPIE Proceedings Series 5716)
ISBN: 0-8194-5690-X
pp.19-25 |
| Conference "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS" <4, 2005, San Jose/Calif.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |