English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Details
Full
Export
Statistics
Options
2005
Conference Paper
Titel
Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Author(s)
Oppermann, H.
Hutter, M.
Engelmann, G.
Reichl, H.
Hauptwerk
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV
Konferenz
Conference "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS" 2005
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM