Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Characterization of epoxy based highly filled die attach materials in microelectronics

 
: Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.

:

Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Keramische Technologien und Systeme -IKTS-, Dresden:
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 3-5 April 2017, Dresden
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-4344-6
ISBN: 978-1-5090-4343-9
ISBN: 978-1-5090-4345-3
pp.150-156
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <18, 2017, Dresden>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

: http://publica.fraunhofer.de/documents/N-455875.html