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Robust design optimization: On methodology and short review

 
: Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B.

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Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Keramische Technologien und Systeme -IKTS-, Dresden:
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 3-5 April 2017, Dresden
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-4344-6
ISBN: 978-1-5090-4343-9
ISBN: 978-1-5090-4345-3
pp.476-482
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <18, 2017, Dresden>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Integrated circuit (IC) packages can delaminate under thermal cyclic loading because of elastic properties mismatch between the components. On the other hand, delamination has no pattern which points out the effect of variations of the design parameters on the response. Hence, a robustness estimation should be done to have more stable IC packages which show no important variations in the response with respect to uncertainties in the design parameters. In this paper, the importance of the robustness estimation for IC package design will be explained and a methodology on robust design estimations will be introduced. After that a short literature review will be given about robust design optimization.

: http://publica.fraunhofer.de/documents/N-455874.html