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Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications

 
: Sedlmair, J.; Mehlmann, B.; Olowinsky, A.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Conference on Electronics Packaging, ICEP 2017 : Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-4-9902188-3-6
ISBN: 978-4-9902188-2-9
ISBN: 978-1-5090-4888-5 (Print)
pp.94-96
International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Laserbonding is a newly developed technology that combines the flexibility and robustness of classical ultrasonic wire-bonding with the advantages of laser welding as regards large connector cross-sections, low quality requirements to surf aces and clamping rigidity. Thanks to modern laser sources with high brilliance, near-infrared radiation can be used in oscillation welding Cu even in a keyhole fashion even though Cu is traditionally considered illsuited for such laser wavelengths. The process is most useful for connecting copper ribbons of 2 × 0, 2 mm size to Li battery cells of the 18650 type but can also be adapted for larger prismatic cells. Further development is geared towards connecting power semiconductors.

: http://publica.fraunhofer.de/documents/N-455814.html