Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Canary devices for through-silicon vias a condition monitoring approach

 
: Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Conference on Electronics Packaging, ICEP 2017 : Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-4-9902188-3-6
ISBN: 978-4-9902188-2-9
ISBN: 978-1-5090-4888-5 (Print)
pp.282-287
International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.

: http://publica.fraunhofer.de/documents/N-455813.html