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Thermo-mechanical reliability analysis on solder joints of ceramic components

 
: Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.

IPC Association Connecting Electronics Industries, Bannockburn/Ill.:
IPC / Soldertec Global 3rd International Conference on Lead-Free Electronics 2005. Towards implementation of the RoHs directive. CD-ROM : Barcelona, Spain, June 6-7, 2005
Barcelona, 2005
International Conference on Lead-Free Electronics <3, 2005, Barcelona>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-45474.html