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Direct laser interference patterning of metallic sleeves for roll-to-roll hot embossing

 
: Lang, Valentin; Rank, Andreas; Lasagni, Andrés-Fabián

:

Klotzbach, U. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based Micro- and Nanoprocessing XI : San Francisco, California, United States, 31 January - 2 February 2017
Bellingham, WA: SPIE, 2017 (Proceedings of SPIE 10092)
Paper 100920T, 10 pp.
Conference "Laser-Based Micro- and Nanoprocessing" <11, 2017, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IWS ()
direct laser interference patterning; high fabrication speed; laser induced periodic surface structures; Roll-to-roll processing; surface functionalization

Abstract
Surfaces equipped with periodic patterns with feature sizes in the micrometer, submicrometer and nanometer range present outstanding surface properties. Many of these surfaces can be found on different plants and animals. However, there are few methods capable to produce such patterns in a one-step process on relevant technological materials. Direct laser interference patterning (DLIP) provides both high resolution as well as high throughput. Recently, fabrication rates up to 1 m2·min-1 could be achieved. However, resolution was limited to a few micrometers due to typical thermal effects that arise when nanosecond pulsed laser systems are used. Therefore, this study introduces an alternative to ns-DLIP for the fabrication of multi-scaled micrometer and submicrometer structures on nickel surfaces using picosecond pulses (10 ps at a wavelength of 1064 nm). Due to the nature of the interaction process of the metallic surfaces with the ultrashort laser pulses, it was not only possible to directly transfer the shape of the interference pattern intensity distribution to the material (with spatial periods ranging from 1.5 μm to 5.7 μm), but also to selectively obtain laser induce periodic surface structures with feature sizes in the submicrometer and nanometer range. Finally, the structured nickel sleeves are utilized in a roll-to-roll hot embossing unit for structuring of polymer foils. Processing speeds up to 25 m·min-1 are reported.

: http://publica.fraunhofer.de/documents/N-452563.html