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Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017

May, 29th - June, 1st, 2017, Bordeaux, France
 
: Benoit, Charlot; Mita, Yoshio; Nouet, Pascal; Pellet, Claude; Pressecq, Francis; Schneider, Peter; Smith, Steward
: Institute of Electrical and Electronics Engineers -IEEE-

Piscataway, NJ: IEEE, 2017, 282 pp.
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2017, Bordeaux>
ISBN: 978-1-5386-2951-2
English
Conference Proceedings
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
simulation; integrated process

: http://publica.fraunhofer.de/documents/N-452457.html