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3D packaging technologies for smart medical implants

 
: Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael

Otto, T. ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, 8 - 9 March 2017, Cork, Ireland
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2017
ISBN: 978-3-95735-057-2
ISBN: 3-95735-057-3
pp.41-47
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2017, Cork>
English
Conference Paper
Fraunhofer IMS ()
Fraunhofer ENAS ()
3D packaging technology; LTCC multilayer interposer; MEMS acceleration sensor; implantable hemodynamic control system

Abstract
In this study, the packaging for an implantable hemodynamic control system is developed and implemented. The system contains sensor elements to measure pressure, acceleration, temperature, voltage and impedance. Furthermore, the system has an inductive link for energy and data transmission. All components are fitted on an LTCC multilayer interposer, which not only connects all components, but also provides a coil for the inductive link. This work focuses on the 3D interconnects of a MEMS acceleration sensor, the integration of all components on the interposer as well as the encapsulation.

: http://publica.fraunhofer.de/documents/N-452456.html