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Embedded die packages and modules for power electronics applications

 
: Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.

International Microelectronics and Packaging Society -IMAPS-:
12th International Conference and Exhibition on Device Packaging 2016 : Fountain Hill, Arizona, USA, 14-17 March 2016
Red Hook, NY: Curran, 2016
ISBN: 978-1-5108-2938-1
pp.96-102
International Conference and Exhibition on Device Packaging (DPC) <12, 2016, Fountain Hill/Ariz.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-445091.html