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Reliability in MID - barriers, potentials, fields of action

: Fechtelpeter, C.; Jürgenhake, C.; Mager, T.; Dumitrescu, R.; Fritz, K.-P.; Grözinger, T.; Wild, P.; Müller, H.; Zimmermann, A.


Franke, J. ; Institute of Electrical and Electronics Engineers -IEEE-:
12th International Congress Molded Interconnect Devices, MID 2016. Scientific proceedings : September 28th-29th, 2016, Würzburg, Germany
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-5428-2
ISBN: 978-1-5090-5426-8
ISBN: 978-1-5090-5427-5
ISBN: 978-1-5090-5429-9
International Congress Molded Interconnect Devices (MID) <12, 2016, Würzburg>
Conference Paper
Fraunhofer IEM ()

The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence, a comprehensive product and process qualification is necessary, because the available guidelines and directives are not sufficient to fulfill the specific requirements around MID.