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In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package

: Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.


Institute of Electrical and Electronics Engineers -IEEE-:
THERMINIC 2016, 22nd International Workshop Thermal Investigations of ICs and Systems : September 21-23, 2016, Budapest, Hungary; Proceedings
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-5451-0
ISBN: 978-1-5090-5450-3
ISBN: 978-1-5090-5452-7
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <22, 2016, Budapest>
Conference Paper
Fraunhofer IZM ()

We have developed a novel, rapid, robust and non-destructive experimental technique for in-situ monitoring of delamination of interfaces for electronic packages. The method is based on a simple thermal transducer matrix of so-called THIXELS (thermal pixels) which allows a spatially resolved real-time image of the current status of delamination. The transducers are small metal wire meanders which are driven and electrically read out using the well-known 3-omega method. This method has special advantages over other thermal contrast methods with respect to robustness, sensitivity and signal-to-noise ratio. Notable is the absence of cross-effects. The proof of concept has been furnished on an industry-grade flip-chip package with underfill on an organic substrate. The technique is especially powerful for buried interfaces, where time-honoured methods like scanning acoustic microscopy (SAM) cannot be applied. As the technique effectively performs a thermal diffusivity sensitive scan, it may not only be useful for stress testing during package qualification, but sensor applications on other fields of health monitoring seem also possible.