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  4. In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
 
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2016
Conference Paper
Title

In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package

Abstract
We have developed a novel, rapid, robust and non-destructive experimental technique for in-situ monitoring of delamination of interfaces for electronic packages. The method is based on a simple thermal transducer matrix of so-called THIXELS (thermal pixels) which allows a spatially resolved real-time image of the current status of delamination. The transducers are small metal wire meanders which are driven and electrically read out using the well-known 3-omega method. This method has special advantages over other thermal contrast methods with respect to robustness, sensitivity and signal-to-noise ratio. Notable is the absence of cross-effects. The proof of concept has been furnished on an industry-grade flip-chip package with underfill on an organic substrate. The technique is especially powerful for buried interfaces, where time-honoured methods like scanning acoustic microscopy (SAM) cannot be applied. As the technique effectively performs a thermal diffusivity sensitive scan, it may not only be useful for stress testing during package qualification, but sensor applications on other fields of health monitoring seem also possible.
Author(s)
Wunderle, B.
May, D.
Abo Ras, M.
Sheva, S.
Schulz, M.
Wöhrmann, M.
Bauer, J.
Keller, J.
Mainwork
THERMINIC 2016, 22nd International Workshop Thermal Investigations of ICs and Systems  
Conference
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2016  
DOI
10.1109/THERMINIC.2016.7749057
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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