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Glass based interposers for RF applications up to 100GHz

: Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter

DOI: 10.1109/ESTC.2016.7764695

	Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society: 6th Electronic System-Integration Technology Conference, ESTC 2016 : Grenoble, 13-16 September 2016 Piscataway, NJ: IEEE, 2016 ISBN: 978-1-5090-1403-3 (Print) ISBN: 978-1-5090-1402-6 (Online) pp.498-504
	Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>

	English
	Conference Paper
	Fraunhofer IZM ()

Abstract
Glass is well established as wafer or panel substrate for applications like capping of image sensors or as low loss carrier for integrated passive devices. Glass substrates with higher functionality becomes more attractive for the advanced packaging due the improvement of glass processing and the increased implementation of photonic packaging which is demanded for higher data transfer rates. The through glass vias are therefore essential for the SiP and 3-D integration.

: http://publica.fraunhofer.de/documents/N-444860.html