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  4. Glass based interposers for RF applications up to 100GHz
 
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2016
Conference Paper
Title

Glass based interposers for RF applications up to 100GHz

Abstract
Glass is well established as wafer or panel substrate for applications like capping of image sensors or as low loss carrier for integrated passive devices. Glass substrates with higher functionality becomes more attractive for the advanced packaging due the improvement of glass processing and the increased implementation of photonic packaging which is demanded for higher data transfer rates. The through glass vias are therefore essential for the SiP and 3-D integration.
Author(s)
Woehrmann, Markus
Juergensen, Nils
Lutz, Mario  
Wilke, Martin
Duan, Xiaomin
Ndip, Ivan  
Töpper, Michael  
Lang, Klaus-Dieter  
Mainwork
6th Electronic System-Integration Technology Conference, ESTC 2016  
Conference
Electronics System-Integration Technology Conference (ESTC) 2016  
DOI
10.1109/ESTC.2016.7764695
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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