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Glass based interposers for RF applications up to 100GHz

 
: Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
6th Electronic System-Integration Technology Conference, ESTC 2016 : Grenoble, 13-16 September 2016
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-1403-3 (Print)
ISBN: 978-1-5090-1402-6 (Online)
pp.498-504
Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Glass is well established as wafer or panel substrate for applications like capping of image sensors or as low loss carrier for integrated passive devices. Glass substrates with higher functionality becomes more attractive for the advanced packaging due the improvement of glass processing and the increased implementation of photonic packaging which is demanded for higher data transfer rates. The through glass vias are therefore essential for the SiP and 3-D integration.

: http://publica.fraunhofer.de/documents/N-444860.html