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A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems

 
: Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
6th Electronic System-Integration Technology Conference, ESTC 2016 : Grenoble, 13-16 September 2016
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-1403-3 (Print)
ISBN: 978-1-5090-1402-6 (Online)
pp.333-339
Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Pixelated LEDs are a new, high efficient light source which allows to control the beam pattern and which are therefore suitable for adaptive front light systems. We will present a concept for hybrid 3D flip chip stacking of pixelated LED chips onto an active matrix driver IC using a new interconnect structure to address thermal management and bonding robustness challenges. Two types of interconnect materials have been investigated: electroplated AuSn solder and nanoporous gold (NPG). We will present the deposition methods and the bonding approach for chip-to-chip and chip-to-wafer bonding and the characteristic results of the bonded interconnects achieved.

: http://publica.fraunhofer.de/documents/N-444856.html