Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Kontaktanordnung zum Herstellen einer Hochfrequenz-Dichtigkeit

Contact arrangement for making high frequency sealing between two electronic circuits - has groove in one front plate in which high frequency seal element is fastened.
 
: Rapp, H.; Guenthner, U.

:
Frontpage ()

DE 1996-19611719 A: 19960325
DE 1996-19611719 A: 19960325
DE 19611719 C2: 19990708
H05K0009
German
Patent, Electronic Publication
Fraunhofer ISST ()

Abstract
(A1) Eine Kontaktanordnung zum Herstellen einer Hochfrequenz- Dichtigkeit zwischen zwei mit einer ihrer Stirnseiten 9 aneinandergrenzenden Frontplatten 13 elektronischer Baugruppen weist ein Hochfrequenz-Dichtungselement 1, 2, 3, 4; 15; 16; 17; 18 auf. Das Hochfrequenz-Dichtungselement 1, 2, 3, 4; 15; 16; 17; 18 ist in einer Nut 6 befestigt, welche wenigstens an einer der Stirnseiten 9 der Frontplatte 13 ausgebildet ist.

 

DE 19611719 A UPAB: 19971113 The contact arrangement makes a high frequency seal between two electronic modules with a front plate (13) joining their rear sides (9). At least one of the front plates (13) has on its rear side (9), which lies opposite the rear side of the other front plate, a groove (6). A high frequency seal element (1,2,3,4) is fastened in the groove (6). Preferably the groove (6) extends along the whole length of the rear side. The seal element (1,2,3,4) may have a holder element (5) by means of which it is fastened in the groove (6). The holder element may be wave-shaped wherein the wave crests and troughs extend perpendicular to the base of the groove. ADVANTAGE - Provides simple but reliable contact between adjacent front plates as close as possible to electronic modules.

: http://publica.fraunhofer.de/documents/N-44485.html