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Thin wafer handling using mechanical- or laser-debondable temporary adhesives

 
: Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.

International Microelectronics and Packaging Society:
11th International Conference and Exhibition on Device Packaging 2015 : Fountain Hills, Arizona, USA, 16 - 19 March 2015
Red Hook, NY: Curran, 2015
ISBN: 978-1-5108-0455-5
pp.305-307
International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-442219.html