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Challenges and simulation solutions for advanced lithography for nanometer interconnect patterning

Presentation held at SISPAD Workshop WS1 "Simulation of Advanced Interconnects", September 5, 2016, Nuremberg, Germany
 
: Evanschitzky, Peter

:
presentation urn:nbn:de:0011-n-4391539 (7.7 MByte PDF)
MD5 Fingerprint: d3e156583638197b94a4774f6071e113
Created on: 7.4.2017


2016, 38 Folien
Workshop WS1 "Simulation of Advanced Interconnects" <2016, Nuremberg>
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) <21, 2016, Nuremberg>
English
Presentation, Electronic Publication
Fraunhofer IISB ()

: http://publica.fraunhofer.de/documents/N-439153.html