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Interconnection Techniques for Ultra Thin ICs and MEMS Elements

: Feil, M.; Adler, C.; Klink, G.; König, M.

Reichl, H.:
Micro System Technologies 2001 : International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001
Berlin: VDE-Verlag, 2001
ISBN: 3-8007-2601-7
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <2001, Düsseldorf>
Conference Paper
Fraunhofer IZM ()
ultra thin IC; assembly; interconnection; isoplanar contact

By advanced wafer thinning technologies integrated circuits with a thickness below 50µm can be fabricated. These very thin chips offer low system height and topography and show enlarged mechanical flexibility, which enables a diverse potential of use possibilities and new applications. However, they require an adjusted assembly and interconnection technology. Different procedures with their advantages and disadvantages are presented and discussed in this paper.