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Li-Fi interconnects for embedded designs in industry 4.0

 
: Faulwaßer, Michael; Deicke, Frank; Ostermann, Robert; Schneider, Tobias

Embedded world Conference 2016. Exhibition & Conference : Nuremberg, Germany, February 23-25, 2016
Haar: WEKA Fachmedien, 2016
ISBN: 978-3-645-50159-0
4 pp.
Embedded World Conference <2016, Nuremburg>
English
Conference Paper
Fraunhofer IPMS ()
optical wireless; infrared; 10 Gb/s; IrDA; mobile; IoT; industry 4.0

Abstract
Nowadays, designers are often confronted with the transfer of high amount of data between mobile targets to provide innovative mechatronic solutions. Typically, that data is generated by analog-digital converters, imaging or other broadband systems. First embedded processing systems are located close to or even on the sensor/actuator platforms and farther away from higher level systems. Non-ideal scenarios with moving, vibrating or rotating components require often a simple wireless communication technology to achieve low-latency machine-to-machine or low-level board-to-board communication. In this situation there is a design gap where connectors cannot be used and wireless RF-technologies additionally limit the system in terms of data rate, regulation, security, EMC and real-time capabilities. Optical-wireless communication shows its strength in these circumstances. A miniaturized optical wireless 10 Gb/s Li-Fi system is presented which allows to setup up high data rate and low-latency real-time links in embedded systems. This system provides bi-directional half and full-duplex communication over a distance of 10 cm with a BER < 1E-11. The transceiver package consumes a small area of 1.4 sq. cm. Straightforward spatial multiplexing of multiple links is described as well as scenarios where optical-wireless is the key technology for board-2-board communication.

: http://publica.fraunhofer.de/documents/N-425896.html