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Active soldering of ceramic-ceramic and ceramic-metal compounds for aerospace applications

: Schmidt, A.; Schubert, T.; Weißgärber, T.; Wilhelmi, C.; Süß, M.; Funke, M.; Kieback, B.

Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-:
Brazing, high temperature brazing and diffusion bonding. LÖT 2016 : Lectures and posters of the 11th international conference taking place in Aachen on 7th to 9th June 2016
Düsseldorf: DVS Media, 2016 (DVS-Berichte 325)
ISBN: 978-3-945023-64-8
International Conference on Brazing, High Temperature Brazing and Diffusion Bonding (LÖT) <11, 2016, Aachen>
Conference Paper
Fraunhofer IFAM, Institutsteil Pulvermetallurgie und Verbundwerkstoffe Dresden ()

At the moment the global market offers a variety of monolithic ceramics and ceramic matrix composite materials (CMCs). Although many of these materials possess unique thermo-mechanical and thermo-chemical properties their utilization is limited to very few applications because of the problem of joining them reliably among themselves or to dissimilar materials like metals. A growing interest in application of joined structures and hybrid compounds can be seen in the area of aerospace industry (e.g. satellite structures) but also earthbound industrial applications are conceivable (e.g. thermal management systems). Active soldering enables the joining of metallic and non-metallic materials whose surfaces are supposed to be difficult-to-wet by metallic solders. Due to the specific composition and a mechanical activation of the molten solder those materials can be joined in a single-step process in air atmosphere. This contribution presents the application of active soldering for the joining of SiC-based materials to similar and dissimilar materials like metal alloys (e.g. Invar). Optimal soldering process parameter were determined systematically. The produced compounds were characterized regarding their joining zone structure and mechanical properties by scanning electron microscopy (SEM) and mechanical testing (apparent shear strength). It was observed that the active soldering process is appropriate for the production of material compounds of the mentioned materials. The process enables the production of robust and thermally conductive joints at joining temperatures between 250 °C and 300 °C.