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Adaption of functional ceramic materials for the laser sintering process in integrated sensor applications

 
: Gradmann, Rena; Seuthe, Thomas; Vedder, Christian; Eberstein, Markus; Partsch, Uwe

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IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT). Online journal 2016 (2016), pp.000011-000017
http://imapsource.org/loi/apap
ISSN: 2380-4491
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) <12, 2016, Denver/Colo.>
English
Journal Article, Conference Paper
Fraunhofer IKTS ()
Fraunhofer ILT ()
thick-film technology; laser sintering; viscosity matching; integrated electronics; sensors

Abstract
The ceramic thick-film technology enables the build-up of miniaturised and robust integrated multilayer-circuits and sensors by means of sequential screen-printing and firing of different functional materials. However, the manufacturing of integrated electronics does not succeed if the components are temperature sensitive or too large for the process in a sintering furnace. At present, large components like wind power rotors, axles or roller bearings are monitored by vulnerable hybrid sensor systems. In order to implement the advantages of integrated devices, like the direct surface contact and the high thermomechanical stability, functional ceramic-based materials are adapted or newly developed to accommodate the needs of laser sintering techniques of printed sensor layers on structural components. Exemplarily, it is shown on steel components that the defect-free densification of functional layers crucially depends on the particular material composition in combination with adapted laser treatment (parameters). A first generation of functional layers is presented, comprising different electrical materials. The films are tested in demonstrator setups and show functional properties comparable to those of the furnace sintering technology. Future aspects of material optimization and the adaption to specific application requirements will be discussed.

: http://publica.fraunhofer.de/documents/N-423470.html