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Investigation of room-temperature flip chip connections

 
: Brink, M.; Grams, A.; Eichhammer, Y.; Broll, M.; Fritzsch, T.; Lang, K.-D.

Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2015 : 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015
Aachen: Apprimus-Verlag, 2015
ISBN: 978-3-86359-296-7
pp.170-177
Smart Systems Integration Conference (SSI) <2015, Copenhagen>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <9, 2015, Copenhagen>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A new flip chip bonding method using a special developed bump structure will be described in this paper. The interconnection is based on plug and socket structures which have been deposited by electroplating on silicon wafers. The plug structure (micro-plug) is a so called mushroom-bump with well-defined overplating. The socket is a barrel-bump structure with an adapted inner diameter. During the bonding process the plug is pressed into the socket to form a force-fitting bond. The process runs with a defined pressure and can be performed at room temperature. The electrical interconnection between temperature sensitive substrates like GaAs, CdTe or bio-functionalized Chips will be possible with the described bonding method.

: http://publica.fraunhofer.de/documents/N-423164.html