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Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process

 
: Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J.

:

Mertens, P.W.:
Ultra clean processing of semiconductor surfaces XIII : Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Pfäffikon: Trans Tech Publications, 2016 (Diffusion and defect data. B, Solid state phenomena 255)
ISBN: 978-3-0357-1084-7
pp.291-296
International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) <13, 2016, Knokke-Heist>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper demonstrates how a low undercut Ti etchant developed by Technic France can be successfully introduced in a high volume manufacturing Fab for etching the under bump metallization (UBM). The Ti etchant has been tested on 300mm wafer production equipment in GLOBALFOUNDRIES. The Ti etchant evaluation has been carried out in collaboration with the Fraunhofer IZM-ASSID institute.

: http://publica.fraunhofer.de/documents/N-422834.html