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All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform

 
: Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.

:

He, Sailing (Hrsg.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Smart photonic and optoelectronic integrated circuits XVIII : 16 - 18 February 2016, San Francisco, California, United States
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 9751)
Paper 97510H
Conference "Smart Photonic and Optoelectronic Integrated Circuits" <18, 2016, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
At the dawning of the exaflop era, High Performance Computers are foreseen to exploit integrated all-optical elements, to overcome the speed limitations imposed by electronic counterparts. Drawing from the well-known Memory Wall limitation, imposing a performance gap between processor and memory speeds, research has focused on developing ultra-fast latching devices and all-optical memory elements capable of delivering buffering and switching functionalities at unprecedented bit-rates. Following the master-slave configuration of electronic Flip-Flops, coupled SOA-MZI based switches have been theoretically investigated to exceed 40 Gb/s operation, provided a short coupling waveguide. However, this flip-flop architecture has been only hybridly integrated with silica-on-silicon integration technology exhibiting a total footprint of 45x12 mm2 and intra-Flip-Flop coupling waveguide of 2.5cm, limited at 5 Gb/s operation. Monolithic integration offers the possibility to fabricate multiple active and passive photonic components on a single chip at a close proximity towards, bearing promises for fast all-optical memories. Here, we present for the first time a monolithically integrated all-optical SR Flip-Flop with coupled master-slave SOA-MZI switches. The photonic chip is integrated on a 6x2 mm2 die as a part of a multi-project wafer run using library based components of a generic InP platform, fiber-pigtailed and fully packaged on a temperature controlled ceramic submount module with electrical contacts. The intra Flip-Flop coupling waveguide is 5 mm long, reducing the total footprint by two orders of magnitude. Successful flip flop functionality is evaluated at 10 Gb/s with clear open eye diagram, achieving error free operation with a power penalty of 4dB.

: http://publica.fraunhofer.de/documents/N-422829.html