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New designs for MEMS-micromirrors and micromirror packaging with electrostatic and piezoelectric drive

: Gu-Stoppel, S.; Stenchly, V.; Kaden, D.; Quenzer, H.J.; Wagner, B.; Hofinann, U.; Dudde, R.

Laudon, M.:
TechConnect briefs 2016. Vol.4: Advanced manufacturing, electronics and microsystems
Danville, CA: TechConnect, 2016
ISBN: 978-0-9975117-4-1 (Set)
ISBN: 978-0-9975117-3-4 (Vol.4)
TechConnect World Innovation Conference and Expo <2016, Washington/DC>
Nanotech Conference & Expo <19, 2016, Washington/DC>
Conference Paper
Fraunhofer IST ()

Developments for miniaturized, MEMS based micromirrors are an active area of ongoing research due to the promising perspectives for cost efficient and precise picoprojectors and scanners for e.g. LID AR applications. In this article we report several devices of 1 -dim and 2-dim micromirrors based on new designs and new process capabilities using piezoelectric actuators. For micro-mirrors an 8Ⳡwafer-level packaging process was developed using preprocessed borosilicate glass wafers. An optimized design of an optical package is presented that avoids any stray reflexes and ghost images in laser projection applications. For 1 dim piezoelectric micro-mirrors, diameter 1.2 mm and 1 mm, scan angles in resonance mode of 40° and 73.2° at frequencies of 60 kHz and 27 kHz in ambient air have been achieved in various designs with driving voltages between 10 V and 15 V. Devices for 2-dim microscanners with electro-static and piezo-electric actuation are presented.