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Flexible assembly module for beam-shaping product families based on support structures

: Haag, S.; Rübenach, O.; Beleke, A.; Haverkamp, T.; Müller, T.; Zontar, D.; Wenzel, C.; Brecher, C.


Kudryashov, A.V. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser Resonators, Microresonators, and Beam Control XVIII : 15-18 February 2016, San Francisco, California, United States
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 9727)
ISBN: 978-1-62841-962-7
Paper 97270W
Conference "Laser Resonators, Microresonators, and Beam Control" <18, 2016, San Francisco/Calif.>
Conference Paper
Fraunhofer IPT ()

Depending on the application, high-power diode lasers (HPDL) have individual requirements on their beam-shaping as well as their mechanical fixation. In order to reduce assembly efforts, laser system manufacturers request pre-assembled beam-shaping systems consisting of a support structure for adhesive bonding as well as one, two or more lenses. Therefore, manufacturers of micro-optics for HPDL need flexible solutions for assembling beam-shaping subassemblies. This paper discusses current solutions for mounting optical subassemblies for beam-shaping of high-power diode lasers and their drawbacks regarding quality and scalability. Subsequently, the paper presents a device which can be used for the sensor-guided assembly of beam-shaping systems based on bottomtab support structures. Results from test productions of several hundred modules are presented showing that repeatability in the range of 1 μm is feasible on an industrial level.