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Broadband dielectric material characterization of epoxy molding compound

 
: Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.

Geßner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2016. Proceedings : International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick
Auerbach: Verlag Wissenschaftliche Scripten, 2016
ISBN: 978-3-95735-040-4
ISBN: 3-95735-040-9
pp.36-43
Smart Systems Integration Conference (SSI) <2016, Munich>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <10, 2016, Munich>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-422716.html